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Hello Yamakoshi,
The S34MS02G200TFI003 is encased in a 48-pin TSO (100% Pb-Free) package, with a copper (Cu) leadframe..
The (Pb-Free) Tin plating thickness on the Copper leadframe is between 12uM to 16uM.
Please launch the URL attached directly below, as it will detail the Packing and Packaging handbook,
and refer to page 1-21, under the title of "Pb-free Plating Composition" for Pb-Free plating thickness.
URL to Packing and Packaging handbook (pg. 1-21) :
http://www.cypress.com/file/294586/download
Hope this helps...
Best regards,
Albert
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Hello Yamakoshi,
The S34MS02G200TFI003 is encased in a 48-pin TSO (100% Pb-Free) package, with a copper (Cu) leadframe..
The (Pb-Free) Tin plating thickness on the Copper leadframe is between 12uM to 16uM.
Please launch the URL attached directly below, as it will detail the Packing and Packaging handbook,
and refer to page 1-21, under the title of "Pb-free Plating Composition" for Pb-Free plating thickness.
URL to Packing and Packaging handbook (pg. 1-21) :
http://www.cypress.com/file/294586/download
Hope this helps...
Best regards,
Albert
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Hello Albert-san,
Thank you for your reply.
Does SECTION B - B in the data sheet "7.1.1 48 - Pin Thin Small Outline Package (TSOP 1)" indicate the plating thickness?
Best regards,
Yamaskoshi
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Hello Yamaskoshi-san,
The plating dimensions within Section B-B actually refer to the lead tip, which is in
Dimension "L" within in Detail A.
Hope this helps...
Best regards,
Albert
Cypress Applications Support
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Hello Albert-san,
Thank you for your reply.
There is a difference between the Datasheet value and the Packing and Packaging handbook value, which is correct?
Please give me detailed explanation.
Best regards,
Yamakoshi
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Hello Yamakoshi-san,
Please use the Pb-Free plating information detailed on page 1-21, within the Packing and Packaging handbook.
The Pb-Free plating of 12uM to 16uM is standard across all Cypress FLASH (TSO package) products.
Thank you and regards,
Albert
Cypress Applications Support.
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Hello Albert-san,
Thank you for your reply many times.
Is the difference between b and b - 1 or c and c - 1 plating thickness?
In the case of plating thickness, which is different from the answered value,which is correct?
Best regards,
Yamakoshi
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Hello Albert-san,
I am waiting for your answer.
Best regards,
Yamakoshi
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Hello Yamakoshi,
As previously stated, the S34MS02G200TFI003 is encased in a 48-pin TSO (100% Pb-Free) package,
with a copper (Cu) leadframe. the (Pb-Free) Tin plating thickness on the Copper leadframe is between
12uM to 16uM, with a grain of 5uM (min).
Please launch the URL attached directly below, as it will detail the Packing and Packaging handbook,
and refer to page 1-21, under the title of "Pb-free Plating Composition" for Pb-Free plating thickness.
URL to Packing and Packaging handbook (pg. 1-21) :
http://www.cypress.com/file/294586/download
Hope this helps...
Best regards,
Albert
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Hello Yamakoshi,
As previously stated, the S34MS02G200TFI003 is encased in a 48-pin TSO (100% Pb-Free) package,
with a copper (Cu) leadframe. the (Pb-Free) Tin plating thickness on the Copper leadframe is between
12uM to 16uM, with a grain of 5uM (min).
Please launch the URL attached directly below, as it will detail the Packing and Packaging handbook,
and refer to page 1-21, under the title of "Pb-free Plating Composition" for Pb-Free plating thickness.
URL to Packing and Packaging handbook (pg. 1-21) :
http://www.cypress.com/file/294586/download
Hope this helps...
Best regards,
Albert