Pin bonding clarification for the SIP (BCM2073xS)

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Anonymous
Not applicable

The following is posted under the blog post, BCM2073XS GPIO Basics

The following GPIOs are available on the BCM2073XS based SIP Modules (remember, only 14 are brought out on the SIP module, so many of these are shared):

  • P8/P33 (Dual bonded, only one of two is available.)
  • P13/P28 (Dual bonded, only one of two is available.)
  • P14/P38 (Dual bonded, only one of two is available.)
  • P12/P26 (Dual bonded, only one of two is available.)
    - P12 if not used as P26 or external 32KHz LPO; If used as 32KHz LPO, then P12 and P26 are unavailable
  • P11/P27 (Dual bonded, only one of two is available.)
    -P11 if not used as P27 or external 32KHz LPO; If used as 32KHz LPO, then P11 and P27 are unavailable



According to the Pin Assignments listed in the datasheet for the SIP, P8/P33 are *not* dual bonded.  In addition to this, P12/P26 aren't dual-bonded either.  This is only appears to be true for the SoC, not the SIP.


Questions: 


1) Is it possible to use both P8 and P33 simultaneously using the SIP?

2) Is it possible to use P12 and P26 simultaneously using the SIP?

3) If a 32kHz LPO is implemented using the SIP, is P26 still unavailable, even though according to the datasheet it's not bonded with P12?



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1 Solution

We have since verified the dual bonded nature of the pins on the SIP with our packaging house and they have confirmed your suspicions.

  • P8/P33 (Dual bonded, only one of two is available)
    Change per information received on 4/28/15: our packaging facility confirmed that P8 and P33 are both available and that on the SIP they are not dual-bonded
  • P13/P28 (Dual bonded, only one of two is available)
  • P14/P38 (Dual bonded, only one of two is available)
  • P12/P26 (Dual bonded, only one of two is available)
    Change per information received on 4/28/15: our packaging facility confirmed that P12 and P26 are both available and that on the SIP they are not dual-bonded
    - P12 if not used as P26 or external 32KHz LPO; If used as 32KHz LPO, then P12 and P26 are unavailable- If external 32KHz OSC is used then P12 is not available, but P26 is available
  • P11/P27 (Dual bonded, only one of two is available)
    -P11 if not used as P27 or external 32KHz LPO; If used as 32KHz LPO, then P11 and P27 are unavailable- If external 32KHz OSC is used then P11 is not available, but P27 is available

I believe the original confusion comes from the fact that the SIP uses the raw die and wirebonds it differently than the DFN SoC part describd here: BCM20737 SOC Data Sheet.

Essentially, this means that the dual bonded IOs described in the SoC datasheet are not bonded together from the die - they are bonded together on the DFN wirebond package (i.e. the SIP does not inherant the limitations of the SoC as once assumed)

The GPIO Blog here has also been updated: BCM2073XS GPIO Basics

View solution in original post

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5 Replies
BoonT_56
Employee
Employee
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For 1) and 2), No, only one of the GPIOs is available

For 3), if an ext LPO is deployed, then P26 and P27 are not available

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Anonymous
Not applicable

Hello,

If this is truly the case then the datasheets for the SIP (BCM2073xS) should be updated to reflect the mutually exclusive nature of these pins.  As it is, the official documentation says it's okay to use them.

Thank you,

Andrew

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andrew997

The developers agree that perhaps there are differences between the dual bonded pins on the SIP and those on the SoC.  I was instructed to create a case with SPIL to confirm the understanding that is published here: BCM2073XS GPIO Basics

nsankar

jakewtorres

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We have since verified the dual bonded nature of the pins on the SIP with our packaging house and they have confirmed your suspicions.

  • P8/P33 (Dual bonded, only one of two is available)
    Change per information received on 4/28/15: our packaging facility confirmed that P8 and P33 are both available and that on the SIP they are not dual-bonded
  • P13/P28 (Dual bonded, only one of two is available)
  • P14/P38 (Dual bonded, only one of two is available)
  • P12/P26 (Dual bonded, only one of two is available)
    Change per information received on 4/28/15: our packaging facility confirmed that P12 and P26 are both available and that on the SIP they are not dual-bonded
    - P12 if not used as P26 or external 32KHz LPO; If used as 32KHz LPO, then P12 and P26 are unavailable- If external 32KHz OSC is used then P12 is not available, but P26 is available
  • P11/P27 (Dual bonded, only one of two is available)
    -P11 if not used as P27 or external 32KHz LPO; If used as 32KHz LPO, then P11 and P27 are unavailable- If external 32KHz OSC is used then P11 is not available, but P27 is available

I believe the original confusion comes from the fact that the SIP uses the raw die and wirebonds it differently than the DFN SoC part describd here: BCM20737 SOC Data Sheet.

Essentially, this means that the dual bonded IOs described in the SoC datasheet are not bonded together from the die - they are bonded together on the DFN wirebond package (i.e. the SIP does not inherant the limitations of the SoC as once assumed)

The GPIO Blog here has also been updated: BCM2073XS GPIO Basics

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Anonymous
Not applicable

Thanks for looking into this!

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