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Hello Team,
My customer need to know if the device BCM20736, he can slightly modify, on his carrier, the footprint PAD' s device stretching outward, for easier inspection and if necessary, rework.
If so, He would like to know also how many millimeters we can expose PAD outward.
I suggested 2mm, what do you think?
Thank a lot
Pierluigi
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Hello Pierluigi,
I checked with our PCB Layout team and they have not had this question before.
The 2mm, may be fine, but again there may be manufacturing issues with the pad exposed.
Thanks
JT
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Hello Pierluigi,
I checked with our PCB Layout team and they have not had this question before.
The 2mm, may be fine, but again there may be manufacturing issues with the pad exposed.
Thanks
JT
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Helli Peirluigi,
I am assuming you are meaning he wants to extend the pads from out under the LGA package. If this is the case this will pose no issues. This certainly allows for probing directly at the package though you can always use testpads or vias for this purpose also.
Regards,
Frank