CY7C65213 QFN soldering

mipr_2773481 Oct 12, 2017 3:39 PM

Does the square pad on the back side of the QFN package need to be connected to ground?

I'm playing with you design kit and want to ensure I get the design right. . .

Thanks

1. Re: CY7C65213 QFN soldering

RoyL_01 Oct 12, 2017 8:01 PM (in response to mipr_2773481)

Recommend to connect to ground. The below apps note has the guidlines of designing QFN package device.
AN72845 - Design Guidelines For Cypress Quad Flat No-Lead (QFN) Packaged Devices | Cypress Semiconductor
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2. Re: CY7C65213 QFN soldering

YangyangC_06 Oct 13, 2017 12:10 AM (in response to mipr_2773481)

Usually the EPAD of an IC will be connected to GROUND of the PCB board. You could also check the Cadance PCB file if you have installed EZ-Serial SDK.
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3. Re: CY7C65213 QFN soldering

mipr_2773481 Oct 13, 2017 1:48 PM (in response to mipr_2773481)

Thanks. The doc helped a lot.
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