CYP15G0403DXB BGA Pad Opening Details

Version 1
    Answer:

     

    Question: Does the CYP15G0403DXB-BGI 256-ball BGA package have Solder Mask Defined or Non-Solder Mask Defined openings?

    Response: This package has Solder Mask Defined openings. The opening dimension is 0.61 +/-0.05mm. The ball pad metal nominal diameter is 0.76mm.