Rad-Hard Wire-Bond Connection - KBA88220

Version 2

    Version: *A

     

    Translation - Japanese: Rad-Hardワイヤーボンド接続 - KBA88220 - Community Translated (JA)

     

    Question:

    What is the wire-bond connection that rad-hard products use?

     

    Answer:

    Rad-hard products use conventional aluminum ultrasonic wire bonding, which is typically used for ceramic packaging. Flip- chip connection technology is not used.