Land Pattern Recommendations for Commonly Used Cypress Packages – KBA225416- Community Translated (JA)

Version 1

    Community Translated by KoKi_1693136          Version: **

     

    Translation - English: Land Pattern Recommendations for Commonly Used Cypress Packages – KBA225416

     

    質問:

    良く使用されている Cypress パッケージ用の推奨ランドパターンはどのようなものがありますか?

     

    回答:

    良く使用されている Cypress のパッケージには以下のようなものがあります。

    100-Ball Ball Grid Array (6.0 × 6.0 × 1.0 mm)

    100 Ball BGA

    44-Pin Thin Small Outline Package Type II

    44 Pin TSOP II

    54-Pin Thin Small Outline Package Type II

    54 Pin TSOP II

    48-Pin Thin Small Outline Package Type I

    48 Pin TSOP I

    28-Pin Thin Small Outline Package

    28 Pin TSOP

    64-Ball Fortified Ball Grid Array (13 x 11 mm)

    64 Ball FBGA 13x11

    8-Pin Small Outline Integrated Circuit (208 mils)

    8 Pin SOIC 208 mils

    8-Pin Dual Flat No Leads (5x6x0.75 mm)

    8 Pin DFN

    8-Pin Ultra-Thin Small Outline No-lead Package

    8 Pin USON

    64-Ball Fortified Ball Grid Array (9x9mm)

    64 Ball FBGA 9x9

    16-Pin Quad Flat No-Leads (3 x 3 x 0.6 mm)

    16 Pin QFN

    8-Pin Small Outline Integrated Circuit (150 mils)

    8 Pin SOIC 150 mils

    100-Pin Thin Quad Flat Package (14 x 14 x 1.4 mm)

    6-pin Ceramic LCC (5 x 3.2 x 1.30 mm)

    8-pin Quad Flat No-Leads (3.28 x 3.28 x 0.55 mm)

    16-pin Small Outline Integrated Circuit

    24-pin Quad Flat No-Leads

    32-Pin Thin Small Outline Package Type II

    32-Pin Thin Small Outline Package Type I

    48-pin Quad Flat No-Leads

    48-Ball Very Fine Pitch Ball Grid Array

    361-Ball Flip Chip Ball Grid Array

    100 Pin TQFP

    6 pin LCC

    8 pin GQFN

    16 pin SOIC

    24 pin QFN

    32 pin TSOP II

    32 pin TSOP I

    48 pin QFN

    48 Ball VFBGA

    361 Ball FCBGA