Thermal Characteristics of CY23S09

Question: What are the thermal resistance values for the CY23S09?

 

Answer:

The thermal parameters for CY23S09 are:

Maximum Junction Temperature is 150°C

CY23S09S (SOIC package)

Theta-Ja = 124 °C/W

Theta-Jc = 50 °C/W

 

CY23S09Z (TSSOP package)

Theta-Ja = 117 °C/W

Theta-Jc = 34 °C/W