TetraHub, QFN package overheating issue

Question: Does the QFN package have any trick to avoid the heating issue?

 

Answer:

QFN (Quad Flatpack No Leads) package, being a lead free package, the electrical contact of the part to the PCB (Printed Circuit Board) is made by soldering the lands on the bottom surface of the package directly to the PCB. Hence special attention is required to the heat transfer area below the package to provide a good thermal bond to the circuit board. Please refer to the Quad Flat Package No Leads (QFN) Package Design Notes section in the datasheet. You also can  refer to the application note on Surface Mount Assembly of Amkor’s MicroLeadFrame (MLF) Technology on Amkor’s website at this URL: http://www.amkor.com/products/notes_papers/MLF_AppNote.