Thermal pad specification for the TX2 QFN package

Question: What is the thermal pad specification for the TX2 QFN package?

 

Answer:

The TX2 QFN package is different from the other USB chips using this package. The size of the die and bond wires affect the size of the pad. The pad is smaller than the other packages (which are from Amkor).

The thermal pad on the TX2 is a max of 187 x 215 mils (width x length).