Recommended PCB Land Pattern for Cypress nvSRAM Packages

Version 1
    Question:

    Does Cypress provide land patterns for all the nvSRAM device packages?

     

    Answer:

    Land pattern for the following nvSRAM packages are provided as guidelines for board layout purpose. 

    1. 8 Lead Small Outline Integrated Circuit (8-SOIC)

    2. 16 Lead Small Outline Integrated Circuit (16-SOIC)

    3. 32 Lead Small Outline Integrated Circuit (32-SOIC)

    4. 44 Lead Thin Small Outline Package Type II (44-TSOP II)

    5. 48 Lead SSOP Shrink Small Outline Packge (48-SSOP)

    6. 48 Lead Thin Small Outline Package Type I (48-TSOP I)

    7. 48 Ball Fine-pitch Ball Grid Array (48-FBGA)

    8. 54 Lead Thin Small Outline Package Type II (54-TSOP II)

    9. 165 Ball Fine-pitch Ball Grid Array (165-FBGA)