What are the basic storage and/or baking instructions for packages with an MSL of 3?
As an example, the LAA-064 package (64ball-Fortif. BGA) has a Moisture Sensitivity Level (MSL) of 3, which is 168hours outof-bag time. Once the moisture barrier bag is opened, the total exposure time to the factory environment, prior to mounting the parts onto a circuit board, should not exceed the recommended "out-of-bag" time, which in this specific example regarding the LAA-064 package is 168hours. The "out-of-bag" time may vary depending upon the moisture-sensitivity rating for the product and is based upon assumptions made about the factory environment to which the product is exposed. Baking of the product is required if :
- The "out-of-bag" time from initial exposure to board mounting is exceeded.
- The out-of-bag product has been stored at an RH of 10% or greater or
- The humidity indicator card is greater than 10% when read at 23°C ± 5°C.
If shipped in high-temperature carriers such as metal tubes or bakeable trays, the product may be baked at 125°C ±5°C for 24 hours before use. Refer to IPC/JEDEC J-STD-033 for the bake procedure if the device carrier cannot withstand this high temperature. The trays in which plastic Cypress packages are shipped can withstand the 125°C temperature.
Please launch the URL attached directly below as it will detail the "CHAPTER 3 - PACKING METHODOLOGIES AND MATERIALS, and refer to pages 3-29 to 3-31 for specific particulars: URL to CHAPTER 3 - PACKING METHODOLOGIES AND MATERIALS :