Version: *C
Translation - Japanese: サイプレス製品に使用されるアルファモールドコンパウンドについて – KBA 89839 - Community Translated (JA)
Question:
Which low-alpha and non-low alpha mold compounds does Cypress Semiconductor use for its products?
Answer:
The materials used for encapsulating semiconductor devices are known as plastic molding compounds. Molding compounds are generally composite materials consisting of epoxy resins, phenolic hardeners, silicas, catalysts, pigments, and mold release agents.
The following table lists the mold compounds used for Cypress products and specifies whether each is low-alpha mold compound material.
| Mold Compound Material Supplier | Mold Compound Material Name | Low-Alpha Mold Compound? |
| Sumitomo | G700 | No |
| Hitachi | CEL 9220HF13 | No |
| Sumitomo | EME-G770H | No |
| Hitachi | CEL9200THF | No |
| Sumitomo | G631 | No |
| Sumitomo | G600 | No |
| Kyocera | KE-G6000DA | Yes |
| Kyocera | KE-G3000DA | No |
| Kyocera | G2250 | Yes |
| Kyocera | G2270 | Yes |
| Kyocera | G1250LK DS | Yes |
| Kyocera | G2250LK DS | Yes |
| Nitto | MP-8500 series | No |
| Sumitomo | 6600H | No |
| Hitachi | CEL 9200CY-R | No |
| Hitachi | CEL 9200THF-U | Yes |
| Hitachi | CEL9200THF | No |
| Hitachi | CEL9200HF | No |
| Nitto | 7470-LA | No |
| Nitto | GE100LFCSV | Yes |
| Plaskon | CK-7000LA | Yes |
| Nitto | MP8000CH | No |
| Henkel | GR9810 –1PLA | Yes |
| Hitachi | CEL9240 | No |
| Toshiba | G1270MC | No |
