Board Design in Traveo™ S6J3110/3120/3200/3300/3350/3400 Series MCUs - KBA217782

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What are the import guidelines for designing the board for the S6J3110/3120/3200/3300/3350/3400 Series MCUs?



The back side of the electric plate should be isolated when a microcontroller is placed on a board to avoid the excess noise. You do not always need to connect the back side electric plate to GND. If you are using a TEQFP package (such as LEP176/LES144/LET208/LEQ216), place the product on a multi-layer board that has 4 or more layers because it reduces heat.