Connection Configurations/Settings for VCC and Gnd/VSS Pins for 48-pin TSOP1 and 63-ball BGA Packages for NAND Flash - KBA218972

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Question:

In the Cypress NAND flash device datasheet, one of the footnotes says: “These pins are assigned as VCC/VSS function, only to comply with ONFI specification. These pins should be connected to power supply or ground (as designated) following the ONFI specification; however, they may not be bonded internally.” Are they connected internally or not?

 

Answer:

In Cypress NAND flash devices, VCC (35 and 39) and VSS (25 and 48) pins can remain unconnected (floating/open) from the PCB for the 48-pin TSOP1 package. Also, VCC (G4) and VSS (D3 and F7) solder ball can remain unconnected (floating/open) from the PCB for the 63-ball BGA package (refer to the figures below).

 

These pins are assigned as the VCC/VSS function, only to comply with ONFI specification. In all our NAND flash devices including MS-1 NAND flash family, MS-2 NAND flash family, ML-1 NAND flash family, and ML-2 NAND flash family, these pins are not bonded internally; so they can be left open. Similarly, the packaging type does not affect this condition; the same procedure can be followed for both TSOP1 and BGA packages.

 

 

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