TiWi-C-W is LSR’s new stand-alone 802.11 b/g/n Wi-Fi module, featuring an ARM Cortex-M3 processor and fully integrated TCP/IP stack on a small footprint (10.5mm x 10.5mm). It is the first module in the LSR portfolio with the pre-integrated cloud agent for the TiWiConnect platform. It can be utilized in a hostless operation mode by utilizing the on-board ARM processor, or perform in a hosted mode via a simple serial UART interface and TiWiConnect LIFT software. It is based on Broadcom’s BCM4390 chipset and is supported by the WICED SDK ecosystem.
TiWi-C-W simplifies the work of adding Wi-Fi connectivity to your products on one of the smallest footprints available, with a breadth of capabilities that ensure a straight-forward integration with your product design, including a pre-loaded cloud connectivity agent for LSR’s TiWiConnect™ platform. Development time and complexity is dramatically reduced for a hosted application, as LSR’s new TiWiConnect LIFT software offers a simple, intuitive serial protocol for the embedded software developer. Simply put, this is the simplest module on the market to integrate Wi-Fi into your product.
Features 2 operating modes:
Hostless operation with on-board ARM Cortex-M3 application processor
Hosted operation via TiwiConnect LIFT simple serial UART interface
Fully Integrated TCP/IP stack
Small footprint: 10.5 mm x 10.5 mm x 1.35 mm
Supports true Antenna Selection Diversity
FCC, IC and CE Module Certification
Both 2 layer and 4 layer reference designs available