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Hi, Infineon team,

I want to know how to design for CSX Touchpad.
It seems that there is the document of AN234185 PSoC™ 4 CAPSENSE™ Touchpad design guide .
But I can't reach this link: https://www.infineon.com/002-34185

The PCB reference data has been gotten from the link in this thread.
https://community.infineon.com/t5/ModusToolbox/PSOC-capsense-touchpad-handwriting/m-p/381127#M497

However, I would like to know the design rules, and why these designs should be used.
If possible, could you provide me the AN234185?

Best Regards,

Hello,

IRFP044NPBF is discontinued, I found IRFP064NPBF, can I use it to replace the IRFP044NPBF ?

My project uses this mosfet as an electronic load for 20V, 3A, 60W max.

Actually it is the count parameter in this API for creating DMA channels, which is interpreted as the number of buffer zones to be allocated for the channel, can it be understood that which channel is configured, this parameter will allocate buffer zones for that channel? I can understand that which channel is configured, this parameter will allocate cache area for that channel?

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I configured the freeRTOS environment through BSP Assistant and Lib Manager, MY MCU is PSOC62, with m0 and m4 kernel, but after configuring it, both m0 and m4 project directories will bring the freeRTOS file, but I only want to use the freeRTOS in the M4 directory.

Kindly provide the MTBF and FIT data for 

Kindly provide the MTBF and FIT data for the following components.

Hi,

I want to translate the following article to Japanese. Please confirm to my work.
KBA "The bootstrap capacitor on the high side of a gate driver provides the energy required to turn on a high-side power switch."
URL: https://community.infineon.com/t5/Knowledge-Base-Articles/The-bootstrap-capacitor-on-the-high-side-of-a-gate-driver-provides-the-energy/ta-p/739554

Best Regards,
Hayashi.K

Before installing HighTech, I could connect to the development board normally using Memtool+MiniWigger debugger, but after installing Hightech, I found that the debugger could not be connected, and the device could not be recognized normally in "Device Manager >Universal Serial Bus Controller ".

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给驱动芯片供电的DC-DC模块正常，IGBT模块是F3L200R12W2H3_B11，驱动芯片选取的是1ED020I12-F2 ，驱动电路如图所示。在上电压为300v的时候，12个驱动芯片坏了9个。后面更换了9个新的驱动芯片以后，上电，给占空比，单个的测G1和E1输出信号，(1)其中有三个只输出是-8V，更换稳压二极管后（如：D7）就可以正常工作了。(2)但是有的无输出，测了驱动芯片的左右侧电路发现，OUT输出电阻断路，有的电阻短路。重新焊接以后发现芯片开始发烫，新焊的电阻开始发黑。(3)还有的是输出在1-2V左右的输出。

请问技术人员，出现以上三种情况是什么原因？为什么-8v是二极管坏了。芯片发烫的原因又是因为什么？发烫的芯片所驱动的管子是T2/T3,T6/T7.都是中间的IGBT，这个是不是IGBT坏了，因为我的直流端口电压在300v,中间IGBT的耐压值是在650v,T1/T4在1200V。